2026, Vol. 6, Issue 1, Part A
Thermal Management Comparison of Through-Hole vs Surface Mount Resistors in Dense PCB Layouts
Author(s): Kim Sung-Ho
Abstract: How does component mounting technology affect heat dissipation in high-density printed circuit boards? This research addresses the thermal performance gap between through-hole technology (THT) and surface mount technology (SMT) resistors under varying power loads and board densities. The investigation employed FR-4 substrates populated with both component types at identical positions, allowing direct thermal comparison through infrared thermography and thermocouple measurements. Temperature data were collected across power dissipation levels ranging from 0.125W to 2.0W, with PCB component densities spanning 25% to 95% coverage. Results indicate that THT resistors maintained surface temperatures 8.7% to 27.5% lower than their SMT counterparts across all test conditions. At maximum power loading (2.0W), THT components reached 103.4°C while SMT variants exceeded 142.6°C under identical ambient conditions. The thermal resistance measurements revealed that through-hole mounting provides superior heat conduction pathways via the plated holes connecting to internal copper planes. However, SMT configurations demonstrated advantages in high-frequency applications where parasitic inductance from lead wires becomes problematic. Board density emerged as a critical factor, with thermal differentials between technologies expanding exponentially above 75% component coverage. These findings suggest that mixed-technology approaches may optimize both thermal and electrical performance in dense PCB designs. The data support recommendations for strategic component placement based on power dissipation requirements and available board real estate.
DOI: 10.22271/27084493.2026.v6.i1a.77
Pages: 01-06 | Views: 40 | Downloads: 14
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How to cite this article:
Kim Sung-Ho. Thermal Management Comparison of Through-Hole vs Surface Mount Resistors in Dense PCB Layouts. Int J Electron Microcircuits 2026;6(1):01-06. DOI: 10.22271/27084493.2026.v6.i1a.77
