2026, Vol. 6, Issue 1, Part A
Characterization of Conductive Ink Traces as Alternative Interconnections for Flexible Electronics
Author(s): Stefan Müller and Anna Schmidt
Abstract: Flexible electronics demand interconnection technologies capable of surviving repeated bending while maintaining electrical performance, requirements that conventional rigid PCB traces cannot satisfy. This research characterized six categories of conductive inks as alternative interconnection materials for flexible substrate applications, evaluating electrical conductivity, mechanical flexibility, adhesion strength, and environmental stability. Test specimens were fabricated on polyethylene terephthalate (PET) and polyimide (PI) substrates using screen printing, inkjet deposition, and aerosol jet techniques. Silver nanoparticle inks achieved the lowest sheet resistance at 12.3±2.1 mΩ/square after thermal sintering at 150°C, satisfying requirements for power distribution and high-frequency signal routing. Carbon nanotube formulations demonstrated superior flexibility, withstanding 15,200±2,100 bend cycles at 5mm radius before exhibiting 10% resistance increase, compared to 8,500±1,200 cycles for silver nanoparticle traces. PEDOT: PSS polymer conductors offered the best flexibility at 18,000±2,500 cycles but with sheet resistance of 450±80 mΩ/square limiting their application to low-current sensing circuits. Environmental stability testing under 85°C/85% relative humidity conditions revealed silver nanoparticle traces maintaining resistance within 15% of initial values after 1,000 hours, while PEDOT:PSS exhibited 65% degradation under identical conditions. Adhesion testing demonstrated that plasma surface treatment improved peel strength by 340% for silver inks on PET substrates. These findings establish quantitative selection criteria matching ink properties to specific flexible electronics applications, enabling designers to optimize the trade-off between conductivity, flexibility, and environmental durability based on application requirements.
DOI: 10.22271/27084493.2026.v6.i1a.82
Pages: 32-37 | Views: 30 | Downloads: 12
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How to cite this article:
Stefan Müller, Anna Schmidt. Characterization of Conductive Ink Traces as Alternative Interconnections for Flexible Electronics. Int J Electron Microcircuits 2026;6(1):32-37. DOI: 10.22271/27084493.2026.v6.i1a.82
