2025, Vol. 5, Issue 2, Part A
Advances in signal integrity and interconnection techniques in high-speed microelectronics
Author(s): Nadeesha Perera, Dilan Jayasinghe and Ishara Fernando
Abstract: The rapid evolution of high-speed digital systems has intensified the need for advanced signal integrity and interconnection design techniques to support multi-gigahertz operation with minimal signal degradation. This study investigates the combined influence of material selection, interconnect topology, via optimization, and adaptive equalization on overall channel performance in high-speed microelectronics. Experimental analysis was performed using low-loss PCB laminates, controlled impedance routing, and advanced via structures, followed by measurements of key performance indicators including insertion loss, return loss, crosstalk, jitter, and eye height across frequencies up to 20 GHz and data rates exceeding 25 Gbps. Statistical evaluation confirmed that PTFE laminates significantly outperform FR-4 in minimizing insertion loss, while embedded differential pair and stripline configurations yielded superior signal integrity compared to microstrip routing. Via optimization through back-drilling and anti-pad tuning demonstrated measurable reductions in jitter and enhancements in eye opening, and adaptive equalization using CTLE and DFE further improved performance at high data rates. The integrated results underscore the critical need for a holistic design methodology that combines physical layout optimization with active compensation techniques to ensure reliable signal transmission in next-generation microelectronic systems. This research provides a structured performance framework for engineers and system designers, offering a pathway toward scalable, energy-efficient, and high-performance interconnect architectures suitable for applications in high-speed computing, data centers, and emerging 5G/6G communication networks.
Pages: 55-59 | Views: 141 | Downloads: 28
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How to cite this article:
Nadeesha Perera, Dilan Jayasinghe, Ishara Fernando. Advances in signal integrity and interconnection techniques in high-speed microelectronics. Int J Electron Microcircuits 2025;5(2):55-59.
