2025, Vol. 5, Issue 2, Part A
Recent trends in flexible and wearable electronics: Implications for microcircuits
Author(s): Dr. Mei-Ling Chen
Abstract: The rapid advancement of flexible and wearable electronics is redefining the design principles of microcircuit technology, enabling a new generation of devices that combine high performance with mechanical adaptability. This study investigates the impact of substrate materials and interconnect architectures on the electrical stability, power efficiency, and long-term durability of wearable microcircuits. Three flexible substrates silk substrate, polydimethylsiloxane (PDMS (polydimethylsiloxane)), and polyimide (PI (polyimide)) were evaluated under repeated mechanical bending up to 10, 000 cycles, while graphene and silver nanowire interconnects were compared for their energy efficiency. Experimental analysis demonstrated that silk substrate substrates exhibited the lowest resistance drift, followed by PDMS (polydimethylsiloxane), while PI (polyimide) demonstrated the highest performance degradation under cyclic strain. graphene interconnect interconnects achieved significantly lower power consumption compared to silver nanowires, highlighting their suitability for energy-sensitive wearable applications. Statistical analysis, including permutation ANOVA and pairwise tests, confirmed the significance of these differences. The results emphasize the importance of co-optimizing substrate flexibility and interconnect conductivity to enhance device resilience and reduce power demands. Practical recommendations include prioritizing soft, bio-derived substrates, integrating low-resistance interconnects, and adopting rigorous fatigue testing for reliable long-term operation. These findings contribute to a foundational design strategy for next-generation wearable electronic systems that are both energy-efficient and mechanically robust.
Pages: 39-43 | Views: 150 | Downloads: 35
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How to cite this article:
Dr. Mei-Ling Chen. Recent trends in flexible and wearable electronics: Implications for microcircuits. Int J Electron Microcircuits 2025;5(2):39-43.
