2024, Vol. 4, Issue 2, Part A
Design and fabrication of photonics-integrated microcircuits using silicon-on-insulator and indium phosphide for high-speed optical data transmission
Author(s): Liam Harris
Abstract: The study titled "Optimization of 5G Microcircuit Design Using ANSYS HFSS and Photolithography: The study titled "Design and Fabrication of Photonics-Integrated Microcircuits Using Silicon-on-Insulator and Indium Phosphide for High-Speed Optical Data Transmission" explores the integration of Silicon-on-Insulator (SOI) and Indium Phosphide (InP) materials to develop high-performance photonics-integrated microcircuits for ultra-fast optical communication. Addressing the growing demand for high bandwidth, low latency, and energy-efficient data transmission systems, the study combines advanced Deep Ultraviolet (DUV) Photolithography and Reactive Ion Etching (RIE) fabrication techniques with simulation tools like Lumerical FDTD and ANSYS HFSS.
Materials and Methods: SOI substrates were used for passive optical components, while InP supported active components, including lasers and photodetectors. Thin films of gold (Au) and copper (Cu) ensured low-resistance electrical interconnections, while protective silicon dioxide (SiO₂) layers enhanced environmental resilience. The circuits were evaluated using Optical Spectrum Analyzers, Vector Network Analyzers (VNA), and Bit Error Rate Testers (BERT).
Results: The microcircuits demonstrated an optical insertion loss of 1.2 dB, BER of 0.00005, latency of 1.5 ms, and SNR of 40.3 dB, with power consumption of 0.35 W. Environmental stability exceeded benchmarks, with temperature resilience up to 55°C and humidity stability at 97%.
Discussion: The integration of SOI and InP materials successfully addressed common challenges in photonic circuit design, including signal integrity, environmental stability, and energy efficiency. The results align with previous studies while offering enhanced scalability and real-world deployment potential.
Conclusion: The study validates the effectiveness of combining SOI and InP platforms with advanced fabrication techniques for developing high-speed, low-latency optical circuits. These findings contribute to advancing next-generation applications in data centers, 5G networks, and cloud computing infrastructure. Future research will focus on scalability, cost optimization, and AI-driven real-time circuit performance enhancements.
DOI: 10.22271/27084493.2024.v4.i2a.57
Pages: 50-55 | Views: 58 | Downloads: 24
Download Full Article: Click Here
How to cite this article:
Liam Harris. Design and fabrication of photonics-integrated microcircuits using silicon-on-insulator and indium phosphide for high-speed optical data transmission. Int J Electron Microcircuits 2024;4(2):50-55. DOI: 10.22271/27084493.2024.v4.i2a.57
